US Patent Issued to SAMSUNG ELECTRONICS on Oct. 28 for "Dry etching apparatus and wafer etching system using the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,627, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Dry etching apparatus and wafer etching system using the same" was invented by Hyunsu Hwang (Siheung-si, South Korea), Suhyeon Ku (Asan-si, South Korea), Junyun Kweon (Cheonan-si, South Korea), Solji Song (Suwon-si, South Korea), Dongjoon Oh (Suwon-si, South Korea) and Chungsun Lee (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a dry etching apparatus including: a plasma process chamber; an edge ring which is arranged in the plasma process chamber and on which a wafer is mounted; a shadow ring positioned to be spaced apart...