US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Semiconductor package including non-conductive film and method for forming the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,456, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package including non-conductive film and method for forming the same" was invented by Yeongbeom Ko (Cheonan-si, South Korea), Wooju Kim (Asan-si, South Korea), Heejae Nam (Asan-si, South Korea), Jungseok Ryu (Asan-si, South Korea) and Haemin Park (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor chip on a substrate. The semiconductor chip includes an active region, and a scribe lane in continuity with an edge of the active region. A non-conductive film (NCF) is between th...