US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Semiconductor package having improved heat dissipation characteristics" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,400, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package having improved heat dissipation characteristics" was invented by Youngsang Cho (Seongnam-si, South Korea), Heeseok Lee (Suwon-si, South Korea) and Yunhyeok Im (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first interconnection structure, a first semiconductor chip disposed on the first interconnection structure and including a plurality of through-vias and first pads connected to the plurality of through-vias; a second semiconductor chip disposed on the first interconnecti...