US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,104, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Keunho Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a chip stack structure on the package substrate, the chip stack structure including a base chip having a first thickness and a plurality of upper chips sequentially stacked on the base chip, wherein the plurality of upper chips each have a second thickness smaller than the first thickness, and a sealing member on an upper surface o...