US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,474, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Dongjoon Oh (Suwon-si, South Korea), Unbyoung Kang (Hwaseong-si, South Korea), Byeongchan Kim (Asan-si, South Korea), Jumyong Park (Cheonan-si, South Korea), Solji Song (Suwon-si, South Korea), Chungsun Lee (Asan-si, South Korea) and Hyunsu Hwang (Siheung-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first semiconductor chip including a first semiconductor substrate including a first active surface and a first inactive surface op...