US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,204, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Jaegwon Jang (Hwaseong-si, South Korea), Seokhyun Lee (Hwaseong-si, South Korea) and Kyoung Lim Suk (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution layer, a first semiconductor chip on the first redistribution layer, a molding layer covering the first semiconductor chip, metal pillars around the first semiconductor chip and connected to the first redistribution layer, a second redistribution layer on the ...