ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,414, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Doyoung Jang (Suwon-si, South Korea) and Eunsu Lee (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first package substrate, a semiconductor chip on the first package substrate, a second package substrate over the first package substrate and the semiconductor chip, and a plurality of core structures and a plurality of solder balls. The core structures and the solder balls are between the first package substrate and the second package substrate, a first portion of ...