US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Semiconductor package, and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,449, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package, and method of manufacturing the same" was invented by Wonil Lee (Hwaseong-si, South Korea), Minki Kim (Suwon-si, South Korea), Jihoon Kim (Cheonan-si, South Korea) and Gwangjae Jeon (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided in which a first insulating layer includes a first recess spaced apart from a first pad in a first direction, and a second insulating layer includes a second recess spaced apart from a second pad in the first direction and overlapping at least a po...