US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Semiconductor device and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,107, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and semiconductor package including the same" was invented by Jingu Kim (Suwon-si, South Korea), Doohwan Lee (Anyang-si, South Korea), Sangkyu Lee (Suwon-si, South Korea), Jeongho Lee (Suwon-si, South Korea) and Taesung Jeong (Osan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate having a recess region, a first electrode in the recess region and having a three-dimensional network structure, a first dielectric layer in the recess region and covering the first electrode, a second ...