ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,009, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and semiconductor package using the same" was invented by Jooyoung Oh (Anyang-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a printed circuit board including a substrate structure having a first surface including a chip mounting region on which a semiconductor chip is mounted and a second surface opposite to the first surface, the second surface having a rectangular shape having a first edge, a second edge, a third edge, and a fourth edge and a first corner, a second corner, a third corner, and a fourth co...