US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Method of fabricating integrated circuit device and method of fabricating electronic system having the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,091, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of fabricating integrated circuit device and method of fabricating electronic system having the same" was invented by Sangmin Kang (Hwaseong-si, South Korea), Hyungjoon Kim (Yongin-si, South Korea) and Woojin Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating an integrated circuit device includes forming on a semiconductor substrate a mold stack that includes a plurality of insulating layers and a plurality of mold layers alternately arranged. A mask pattern including an opening is formed on the mold s...