US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Light emitting diode with conductive encapsulation and method of making thereof" (California Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,220, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Light emitting diode with conductive encapsulation and method of making thereof" was invented by Brian Kim (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, such that each of the light emitting diodes includes a stack of a first doped semiconductor layer, a second doped semiconductor layer and an active region located between the first and the second doped semiconductor layers, and a conductive encapsulation layer in ...