US Patent Issued to SAMSUNG ELECTRONICS on Oct. 21 for "Foldable electronic device comprising heat-dissipating structure" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,056, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Foldable electronic device comprising heat-dissipating structure" was invented by Jaeyoung Huh (Suwon-si, South Korea), Jonghoon Lim (Suwon-si, South Korea), Ohhyuck Kwon (Suwon-si, South Korea), Ahreum Hwang (Suwon-si, South Korea) and Sungchul Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipating structure of a foldable electronic device is provided. The electronic device includes a first housing including a first component, a second housing including a second component, a hinge assembly rotatably coupling the firs...