ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,452,942, issued on Oct. 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Dual-connectivity establishment method and device" was invented by Hong Wang (Beijing), Lixiang Xu (Beijing) and Xiaowan Ke (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present invention provide a dual-connectivity (DC) establishment method and device. The first DC architecture includes a Master Node (MN) and a Secondary Node (SN), wherein the SN includes a Central Unit (CU) and a Distributed Unit (DU); and, the CU includes a Control Plane functional entity (CP) and a User Plane functional entity (UP). The method includes step...