US Patent Issued to SAMSUNG ELECTRONICS on Oct. 14 for "Semiconductor package and method of manufacturing semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,662, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing semiconductor package" was invented by Dahee Park (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, an interposer on the package substrate, a plurality of semiconductor devices on the interposer and spaced apart from each other, the semiconductor devices being electrically connected to the interposer, a dam structure on the interposer extending along a peripheral region of the interposer, the dam structure being spaced apart from t...