US Patent Issued to SAMSUNG ELECTRONICS on Oct. 14 for "Semiconductor integrated circuit, a method for testing the semiconductor integrated circuit, and a semiconductor system" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,858, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor integrated circuit, a method for testing the semiconductor integrated circuit, and a semiconductor system" was invented by Hyungil Woo (Hwaseong-si, South Korea), Sungcheol Park (Seoul, South Korea) and Jehyun Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor integrated circuit to receive a test scan input, a test clock, and a test mode signal and output a secure scan output signal, the integrated circuit including: a secure key circuit to generate delay input signals, which are differently delayed fro...