ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,700, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor device, semiconductor package, and memory system" was invented by Kwangsook Noh (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an element region including a semiconductor substrate and a plurality of elements formed on the semiconductor substrate and a wiring region disposed on the element region and including an interlayer insulating layer, a plurality of wiring patterns in the interlayer insulating layer, and a via structure extending in a first direction, perpendicular to an upper s...