US Patent Issued to SAMSUNG ELECTRONICS on Oct. 14 for "Semiconductor device, electronic system including the same, and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,222, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device, electronic system including the same, and method of fabricating the same" was invented by Seokcheon Baek (Hwaseong-si, South Korea), Miram Kwon (Suwon-si, South Korea) and Seongjun Seo (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate having cell and connection regions, and a stack structure having dielectric layers and electrodes that are vertically and alternately stacked on the substrate. The stack structure includes a first pad part, a first fence part, a second pa...