ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,589, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Operation method of etching apparatus and method of manufacturing semiconductor device using the same" was invented by Dooyoung Gwak (Suwon-si, South Korea), Soonam Park (Suwon-si, South Korea), Janggyoo Yang (Suwon-si, South Korea), Myungsun Choi (Suwon-si, South Korea) and Jaemin Ha (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An operation method of an etching apparatus includes transferring, from a load lock chamber to a process chamber, a substrate on which an etching target layer is formed, first etching the etching target lay...