ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,703, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Manufacturing method of semiconductor chip" was invented by Yongbum Kwon (Yongin-si, South Korea) and Unbyoung Kang (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor chip is provided. The method includes: forming a plurality of bonding pads on a semiconductor wafer, sequentially forming an insulating layer and a polishing stop film on the semiconductor wafer to cover the plurality of bonding pads, the insulating layer and the polishing stop film having a plurality of convex portions correspon...