ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,710, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Image sensor package" was invented by Seungryong Oh (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor package includes an image semiconductor chip, and an image sensor in the image semiconductor chip. The package includes a dam structure on a substrate of the image semiconductor chip, and the dam structure includes a plurality of dams. The package includes a glass plate on the dam structure. A top surface of the dam structure and a bottom surface of the glass plate are on a substantially same plane, and the plurali...