ALEXANDRIA, Va., Oct. 21 -- United States Patent no. D1,098,089, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Cover for electronic device" was invented by Bosoon Kang (Suwon-si, South Korea), Kangmoon Kim (Suwon-si, South Korea), Byoungjin Kim (Suwon-si, South Korea), Taeho Kim (Suwon-si, South Korea), Junyong Song (Suwon-si, South Korea), Taekkyung Lee (Suwon-si, South Korea), Woohyeok Jeong (Suwon-si, South Korea) and Junghyun Choi (Suwon-si, South Korea).
The patent was filed on Sept. 9, 2024, under Application No. D/961,870.
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