US Patent Issued to SAMSUNG ELECTRONICS on Oct. 14 for "Chip wet transfer method and equipment using magnetic force" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,638, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Chip wet transfer method and equipment using magnetic force" was invented by Youngtek Oh (Suwon-si, South Korea), Kyungwook Hwang (Suwon-si, South Korea), Dongho Kim (Suwon-si, South Korea), Joonyong Park (Suwon-si, South Korea), Sanghoon Song (Suwon-si, South Korea), Minchul Yu (Suwon-si, South Korea) and Junsik Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip wet transfer method includes: preparing a transfer substrate that includes a plurality of recesses; supplying a liquid that includes semiconductor chi...