US Patent Issued to SAMSUNG ELECTRONICS on Nov. 4 for "Wafer drying apparatus, wafer processing system including the same, and wafer processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,061, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wafer drying apparatus, wafer processing system including the same, and wafer processing method using the same" was invented by Sangjine Park (Suwon-si, South Korea), Jihoon Jeong (Seonnam-si, South Korea), Young-Hoo Kim (Yongin-si, South Korea) and Kuntack Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer drying apparatus is disclosed. The wafer drying apparatus may include a drying chamber housing providing a drying space, in which a wafer is disposed, a supercritical fluid supplying part configured to supply a supercritical...