ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,125, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package including post" was invented by Gongje Lee (Seoul, South Korea) and Sangkyu Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package according to an example embodiment of the disclosure includes a first redistribution layer including a first via, a first redistribution pattern, and a first insulating layer, a first semiconductor chip connected to the first redistribution layer via a chip connection terminal, a lower post directly connected to the first redistribution layer, an upper post connecte...