US Patent Issued to SAMSUNG ELECTRONICS on Nov. 4 for "Semiconductor package including a dummy chip" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,105, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including a dummy chip" was invented by Hyeongmun Kang (Hwaseong-si, South Korea), Taehyeong Kim (Suwon-si, South Korea), Woodong Lee (Cheonan-si, South Korea) and Hwanyoung Choi (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base structure, a lower semiconductor chip disposed on the base structure, an upper semiconductor chip disposed on the lower semiconductor chip, a connecting structure including a lower pad disposed on the lower semiconductor chip, an upper pad disposed u...