ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,179, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package and method for fabricating the same" was invented by Won Hee Hwang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes a substrate; a plurality of first semiconductor chips on the substrate and spaced apart from each other in a first direction; a plurality of second semiconductor chips on the plurality of first semiconductor chips; a spacer between an uppermost one of the plurality of first semiconductor chips and a lowermost one of the plurality o...