ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,126, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).
"Semiconductor package" was invented by Jungjoo Kim (Suwon-si, South Korea), Yongkwan Lee (Suwon-si, South Korea), Seung Hwan Kim (Suwon-si, South Korea), Jongwan Kim (Suwon-si, South Korea), Junwoo Park (Suwon-si, South Korea), Taejun Jeon (Suwon-si, South Korea) and Junhyeung Jo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a dielectric layer on a substrate and having an opening that partially exposes a top surface of the substrate, a capacitor chip on the substrate and in the opening of the diele...