ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,122, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Pilsung Choi (Cheonan-si, South Korea), Donguk Kwon (Asan-si, South Korea), Sangsoo Kim (Cheonan-si, South Korea), Wooram Myung (Suwon-si, South Korea), Jiwon Shin (Daejeon, South Korea) and Sehun Ahn (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a lower substrate including a lower wiring layer; a semiconductor chip disposed on the lower substrate, the semiconductor chip including a first surface facing the lower substrate and a second surface opposite to the firs...