US Patent Issued to SAMSUNG ELECTRONICS on Nov. 4 for "Nonvolatile memory package, storage device including the same, and method of operating thereof" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,462,857, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Nonvolatile memory package, storage device including the same, and method of operating thereof" was invented by Anil Kavala (Yongin-si, South Korea), Youngmin Jo (Suwon-si, South Korea), Jungjune Park (Suwon-si, South Korea) and Chiweon Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A storage device includes a plurality of memory chips, a buffer chip connected to the plurality of memory chips, and a controller connected to the buffer chip. The buffer chip is configured to periodically receive a first command from the controller, a...