US Patent Issued to SAMSUNG ELECTRONICS on Nov. 4 for "Method and device for setting state of bundle after transfer of bundle between apparatuses" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,348, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method and device for setting state of bundle after transfer of bundle between apparatuses" was invented by Taehyung Lim (Suwon-si, South Korea), Jonghoe Koo (Suwon-si, South Korea), Kangjin Yoon (Suwon-si, South Korea), Duckey Lee (Suwon-si, South Korea) and Hyewon Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Intern...