US Patent Issued to SAMSUNG ELECTRONICS on Nov. 4 for "Method and apparatus for transceiving data by using dual connectivity of integrated access and backhaul node in wireless communication system" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,557, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Seoul, South Korea).

"Method and apparatus for transceiving data by using dual connectivity of integrated access and backhaul node in wireless communication system" was invented by Seunghoon Choi (Gyeonggi-do, South Korea), Youngbum Kim (Gyeonggi-do, South Korea) and Hyunseok Ryu (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. Provided is a method of transmitting or receiving data by an integrated access and backhaul (IAB) node in a wireless communicatio...