ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,574, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Electronic device including heat dissipation structure" was invented by Hyunje Cho (Suwon-si, South Korea) and Jiwoo Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment, an electronic device comprises: a housing comprising an opening; a cover for opening and closing the opening; and a link structure located inside the housing and connected to the cover, wherein the link structure may comprise: an actuator configured to output power based on the temperature sensed inside the housing; a first link configured to ...