US Patent Issued to SAMSUNG ELECTRONICS on Nov. 4 for "Edge ring, substrate processing apparatus having the same and method of manufacturing semiconductor device using the apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,018, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Edge ring, substrate processing apparatus having the same and method of manufacturing semiconductor device using the apparatus" was invented by Hongtaek Lim (Seoul, South Korea), Junghyeon Kim (Yongin-si, South Korea), Sanggon Shin (Hwaseong-si, South Korea), Oleg Feygenson (Hwaseong-si, South Korea), Kyuho Lee (Hwaseong-si, South Korea), Donghoon Han (Seoul, South Korea) and Kwangpyo Hong (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An edge ring includes an annular body portion having a bottom surface and a top surface, a first s...