US Patent Issued to SAMSUNG ELECTRONICS on Nov. 25 for "Wireless interconnect for high-rate data transfer" (Russian Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,745, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Wireless interconnect for high-rate data transfer" was invented by Anton Sergeevich Lukyanov (Moscow) and Mikhail Nikolaevich Makurin (Moscow).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates generally to radio engineering, and for example, to high-rate wireless data transfer between different printed circuit boards or between parts of the same printed circuit board. The technical result is easier fabrication, smaller dimensions, lower losses at high frequencies and improved performance. According to the disclosure, a wireless d...