US Patent Issued to SAMSUNG ELECTRONICS on Nov. 25 for "Semiconductor package including processor chip and memory chip" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,800, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including processor chip and memory chip" was invented by Kil-soo Kim (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a processor chip mounted on a first region of the package substrate, a plurality of memory chips mounted on a second region of the package substrate being spaced apart from the first region of the package substrate, a signal transmission device mounted on a third region of the package substrate between the first and second regions of the pac...