US Patent Issued to SAMSUNG ELECTRONICS on Nov. 25 for "Semiconductor package including power plane connecting power terminal of passive device unit and dummy bump of interposer" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,764, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including power plane connecting power terminal of passive device unit and dummy bump of interposer" was invented by Juyoun Choi (Hwaseong-si, South Korea), Miyeon Kim (Hwaseong-si, South Korea) and Jungil Son (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package base substrate including a potential plate. An interposer is arranged on the package base substrate and comprises at least one interposer through electrode, at least one first connection bump, and at least one seco...