US Patent Issued to SAMSUNG ELECTRONICS on Nov. 25 for "Semiconductor package including heat dissipation structure" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,721, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including heat dissipation structure" was invented by Yeonho Jang (Suwon-si, South Korea), Inhyung Song (Suwon-si, South Korea), Kyungdon Mun (Suwon-si, South Korea) and Hyeonjeong Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides semiconductor packages including a heat dissipation structure. In some embodiments, the semiconductor package includes a package substrate, a stacked chip disposed on the package substrate and including a lower chip and an upper chip, a memory chip di...