ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,789, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Buwon Kim (Suwon-si, South Korea) and Sangsub Song (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, a semiconductor package includes a package substrate that includes a first surface, a second surface that is opposite to the first surface, first substrate pads disposed on the first surface in a first row, and second substrate pads disposed on the first surface in a second row. The semiconductor package further includes a first semiconductor chip that includes first chip pads, ...