US Patent Issued to SAMSUNG ELECTRONICS on Nov. 25 for "Semiconductor inspection method including heating a top surface of a semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,681, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Semiconductor inspection method including heating a top surface of a semiconductor package" was invented by Soonkyu Hwang (Asan-si, South Korea), Jinyeol Yang (Cheonan-si, South Korea), Haegu Lee (Anyang-si, South Korea), Jae-Min Jeon (Asan-si, South Korea) and Jin Hee Han (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor inspection apparatuses, systems, and methods. The semiconductor inspection method comprises heating a top surface of a semiconductor package, capturing the top surface of the heated semico...