US Patent Issued to SAMSUNG ELECTRONICS on Nov. 25 for "CMP (chemical mechanical planarization) retaining ring" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. D1,103,131, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"CMP (chemical mechanical planarization) retaining ring" was invented by Hyungjoo Lee (Suwon-si, South Korea), Hyeondong Song (Suwon-si, South Korea), Joonsuk Jeong (Suwon-si, South Korea) and Kyumin Sim (Suwon-si, South Korea).

The patent was filed on Sept. 1, 2023, under Application No. D/901,571.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1103131&OS=D1103131&RS=D1103131

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