US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Semiconductor package including through-silicon via and method of forming the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,179, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including through-silicon via and method of forming the same" was invented by Inhyo Hwang (Asan-si, South Korea), Younglyong Kim (Anyang-si, South Korea) and Hyunsoo Chung (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate and a plurality of sub-packages provided on the package substrate. Each of the plurality of sub-packages includes a semiconductor chip, an interposer provided adjacent to the semiconductor chip, the interposer including a plurality of first t...