US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Semiconductor package and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,225, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Young Lyong Kim (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip mounted on a substrate, a first conductive post disposed on the substrate and spaced apart from the first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip and the first conductive post, and a mold layer on the substrate that covers the first and second semiconductor chips and the first conductive pos...