ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,184, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor device and method of fabricating the same" was invented by John Soo Kim (Hwaseong-si, South Korea), Min Wook Chung (Suwon-si, South Korea), Kyoung Suk Kim (Seongnam-si, South Korea), Soo Kyung Kim (Daegu, South Korea), Won Suk Lee (Hwaseong-si, South Korea) and Jong Jin Lee (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided. The semiconductor device includes: a first interlayer insulating film defining a lower wiring trench; a lower wiring structure including a first lower barrier film which ...