US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "MM-wave resonant termination load embedded in a PCB substrate and antenna array including the same" (Russian Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,375, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"MM-wave resonant termination load embedded in a PCB substrate and antenna array including the same" was invented by Gennadiy Aleksandrovich Evtyushkin (Moscow), Elena Aleksandrovna Shepeleva (Moscow) and Anton Sergeevich Lukyanov (Moscow).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna array is provided that includes at least one active element and at least one passive element arranged around the active element. The passive element includes at least one feeding line disposed between a first ground layer and a second ground layer, a first patch loc...