ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,741, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Methods of manufacturing semiconductor devices" was invented by Byongju Kim (Suwon-si, South Korea), Dongsung Choi (Suwon-si, South Korea), Wonjun Park (Suwon-si, South Korea), Donghwa Lee (Suwon-si, South Korea), Jaemin Jung (Suwon-si, South Korea) and Changheon Cheon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is provided including the operations of forming a peripheral circuit structure including a substrate, circuit elements on the substrate, and interconnections on the circuit ...