US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Method and system for testing and manufacturing semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,400, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Method and system for testing and manufacturing semiconductor device" was invented by Bumsuk Chung (Suwon-si, South Korea), Hyungseok Kang (Suwon-si, South Korea), Kyewan Park (Suwon-si, South Korea), Sungbo Shim (Suwon-si, South Korea), Sanghyun Ahn (Suwon-si, South Korea), Inkap Chang (Suwon-si, South Korea) and Minho Jeong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of testing a semiconductor device includes obtaining first data generated by testing wafers, each including a plurality of chips, the obtaining based on...