US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Memory devices performing selective post package repair, electronic devices including the same, and operating methods of the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,993, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea).

"Memory devices performing selective post package repair, electronic devices including the same, and operating methods of the same" was invented by Taekhoon Kim (Suwon-si, South Korea) and June-Hyun Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a memory device which includes a plurality of memory chips. Each of the plurality of memory chips, in response to a post package repair (PPR) command a target value received from a controller, performs a write operation of write data with respect to memory cells corresponding...