US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Light emitting diode (LED) package having reflection molding layer covering led chip" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,875, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Light emitting diode (LED) package having reflection molding layer covering led chip" was invented by Jongho Lim (Suwon-si, South Korea), Jaehyuk Lim (Hwaseong-si, South Korea), Hosik Jun (Hwaseong-si, South Korea), Hyojeong Kang (Hwaseong-si, South Korea) and Yonggi Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and si...