US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Interconnection structure and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,180, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Interconnection structure and semiconductor package including the same" was invented by Ju-Il Choi (Seongnam-si, South Korea), Jumyong Park (Cheonan-si, South Korea), Jin Ho An (Seoul, South Korea), Chungsun Lee (Ansan-si, South Korea), Teahwa Jeong (Hwaseong-si, South Korea) and Jeonggi Jin (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor package may include: forming a photoimageable dielectric layer on a substrate including a pad; forming a preliminary via hole in the photoimageable dielectric ...